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Job Details: Job Description: Join our team as a Silicon Packaging Design Engineer in the Data Center Group, where you will play a pivotal role in crafting cutting-edge silicon packaging solutions that drive Intel's innovation and technological leadership. In this role, you will be engaged in the end-to-end development of substrate designs, from concept to tapeout, ensuring optimized performance and manufacturability. Collaborating closely with cross-functional teams, your contributions will directly impact product quality, cost efficiency, and time-to-market for Intel's next-generation technologies. This is an exciting opportunity to start your career in a collaborative environment that fosters learning and professional growth. Key Responsibilities - Drive the complete development of substrate designs, starting from initial concept through tapeout. - Perform physical layout and routing of package designs, ensuring adherence to design requirements. - Conduct substrate fit and routing studies to establish optimal tradeoffs between design, performance, and cost. - Collaborate with silicon and hardware teams to optimize silicon-package-board performance and pinout configurations. - Define and implement substrate design rules to meet product and manufacturing requirements. - Perform internal and external design reviews, analyze data, and resolve design rule violations (DR
American multinational technology company
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