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Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Responsibilities will include, but are not limited to: • Work on electrical and physical design of high-speed interfaces in packages. • Work on electrical model extraction and validation of package interconnects with circuit design team and IP vendor to optimize silicon layout and package design. • Electrical modeling, simulation and characterization of high-speed interfaces. • Develop and execute test plans to validate package electrical models with measurements. • Work with product engineering and system engineering for package correlation and validation in system environment. • Driving innovation into the future Memory generations within a dynamic work environment. • Translate engineering problems into scalable Artificial Intelligence and automation solutions Educational & Other Requirements: • MTech in Electrical Engineering with strong emphasis in Electromagnetics, Microwave, Antenna Theory and RF Circuits. • Required Familiarity with Ansys, Siemens or Cadence tools for frequency domain modeling, Frequency domain analysis and transient time domain analysis. About Mi
American multinational corporation based in Boise, Idaho
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